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Civil-Comp Proceedings
ISSN 1759-3433
CCP: 106
PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
Edited by:
Paper 139

Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading

Y. Aoues1, A. Makhloufi1, A. El-Hami1 and P. Pougnet2

1Laboratoire d'Optimisation et de Fiabilité en Mécanique des Structures, INSA Rouen-LOFIMS, Saint Etienne de Rouvray, France
2Valeo, France

Full Bibliographic Reference for this paper
Y. Aoues, A. Makhloufi, A. El-Hami, P. Pougnet, "Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 139, 2014. doi:10.4203/ccp.106.139
Keywords: kriging metamodel, reliability, optimization, fatigue, solder joint..

Summary
Reliability is a major concern in the microelectronics industry. However, new packaging and assembly technologies and requirements to comply with environmental friendly directives create challenges in assuring the reliability of mechatronics products for higher performance and lower cost. Deterministic design modelling does not take into account the uncertainties of design parameters and the variability of operating conditions in service. In this paper, reliability-based design optimization (RBDO) is developed to search for the optimal geometrical configuration of the solder so that fatigue performances are better. Moreover, the RBDO formulation allows for dealing with uncertainties related to geometrical dimensions and temperature loading. The RBDO approach is combined with the kriging approximation in order to surrogate the thermo-mechanical nonlinear finite element model. This paper demonstrates the effectiveness of the RBDO method with the kriging metamodel to conduct the design optimization of complex structures.

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