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Civil-Comp Proceedings
ISSN 1759-3433
ISSN 1759-3433
CCP: 106
PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
Edited by: B.H.V. Topping and P. Iványi
Paper 139
Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading
Y. Aoues1, A. Makhloufi1, A. El-Hami1 and P. Pougnet2
1Laboratoire d'Optimisation et de Fiabilité en Mécanique des Structures, INSA Rouen-LOFIMS, Saint Etienne de Rouvray, France
2Valeo, France
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