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Civil-Comp Proceedings
ISSN 1759-3433
CCP: 106
PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
Edited by:
Paper 129

A Probabilistic Approach for the Reliability Assessment of Power Modules using Coupled Thermal-Mechanical Simulation

A. Makhloufi, Y. Aoues and A. El-Hami

Laboratoire d'Optimisation et Fiabilité en Mécanique des Structures, INSA of Rouen, Saint Etienne-du-Rouvray, France

Full Bibliographic Reference for this paper
A. Makhloufi, Y. Aoues, A. El-Hami, "A Probabilistic Approach for the Reliability Assessment of Power Modules using Coupled Thermal-Mechanical Simulation", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 129, 2014. doi:10.4203/ccp.106.129
Keywords: power modules, probability, reliability, finite element, kriging..

Summary
This paper presents a numerical investigation of the probabilistic approach in estimating the reliability of wire bonding for microelectronic device structures. The finite element simulation model is used to analyze the sequence of the failure events in power microelectronic devices. This numerical model is used to estimate the probability of failure of power module regarding the wire bonding connection. However, as a result of the time-consuming methods of the multiphysics finite element simulation, a kriging metamodel is used as a surrogate for the response output of the limit state, in this way the reliability analysis is performed directly to the kriging approximation by using the FORM/SORM methods. This study demonstrates the appropriateness of using the reliability approach to predict the effects of the wire bonding failure of power modules.

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