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Y. Hwang, H. Jeong, D. Kim, J. Bae, G. Noh, "A Multiscale Optimization Framework for Enhanced Warpage Control in Ceramic Substrates", in P. Iványi, J. Kruis, B.H.V. Topping, (Editors), "Proceedings of the Eighteenth International Conference on Civil, Structural and Environmental Engineering Computing", Civil-Comp Press, Edinburgh, UK, Online volume: CCC 10, Paper 3.4, 2025,

Keywords: ceramic substrate, warpage, multiscale modelling, homogenization, surrogate model, finite element analysis, optimization.

Abstract

In this study, a novel framework that integrates multiscale modelling and metaheuristic optimization is developed to minimize warpage in ceramic substrates used in microelectronics packaging. Ceramic substrates are prone to warpage due to the complex interactions between the ceramic microstructure and the heterogeneous circuit layout. To predict warpage accurately, effective ceramic material properties are derived using Laguerre–Voronoi tessellation combined with finite element-based homogenization, which captures the biphasic nature of sintered ceramics. A composite CAD model is generated to incorporate the substrate’s hole features, and a volume-fraction-based homogenization method is applied to address the inhomogeneity between metallic and ceramic layers. To reduce computational effort, a surrogate model is trained on a multiscale warpage simulation dataset to predict the average vertical nodal displacement on the substrate’s central plane under thermal loading. The optimal combination of design parameters that minimizes warpage is determined using the Teaching–Learning-Based Optimization (TLBO) algorithm. Validation against fine-scale simulations confirms that the proposed framework effectively predicts substrate warpage and identifies feasible, optimal design solutions.

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Front Page Browse CCC CCP CSETS CTR IJRT Other Authors Search Purchase Guide FAQ Contact us	Civil-Comp Conferences ISSN 2753-3239 CCC: 10 PROCEEDINGS OF THE EIGHTEENTH INTERNATIONAL CONFERENCE ON CIVIL, STRUCTURAL AND ENVIRONMENTAL ENGINEERING COMPUTING Edited by: P. Iványi, J. Kruis and B.H.V. Topping Paper 3.4 A Multiscale Optimization Framework for Enhanced Warpage Control in Ceramic Substrates Y. Hwang, H. Jeong, D. Kim, J. Bae and G. Noh Department of Mechanical Engineering, Korea University, Seoul, Republic of Korea Full Bibliographic Reference for this paper Y. Hwang, H. Jeong, D. Kim, J. Bae, G. Noh, "A Multiscale Optimization Framework for Enhanced Warpage Control in Ceramic Substrates", in P. Iványi, J. Kruis, B.H.V. Topping, (Editors), "Proceedings of the Eighteenth International Conference on Civil, Structural and Environmental Engineering Computing", Civil-Comp Press, Edinburgh, UK, Online volume: CCC 10, Paper 3.4, 2025, Keywords: ceramic substrate, warpage, multiscale modelling, homogenization, surrogate model, finite element analysis, optimization. Abstract In this study, a novel framework that integrates multiscale modelling and metaheuristic optimization is developed to minimize warpage in ceramic substrates used in microelectronics packaging. Ceramic substrates are prone to warpage due to the complex interactions between the ceramic microstructure and the heterogeneous circuit layout. To predict warpage accurately, effective ceramic material properties are derived using Laguerre–Voronoi tessellation combined with finite element-based homogenization, which captures the biphasic nature of sintered ceramics. A composite CAD model is generated to incorporate the substrate’s hole features, and a volume-fraction-based homogenization method is applied to address the inhomogeneity between metallic and ceramic layers. To reduce computational effort, a surrogate model is trained on a multiscale warpage simulation dataset to predict the average vertical nodal displacement on the substrate’s central plane under thermal loading. The optimal combination of design parameters that minimizes warpage is determined using the Teaching–Learning-Based Optimization (TLBO) algorithm. Validation against fine-scale simulations confirms that the proposed framework effectively predicts substrate warpage and identifies feasible, optimal design solutions. download the full-text of this paper (PDF, 8 pages, 461 Kb) go to the previous paper go to the next paper return to the table of contents return to the volume description
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