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Civil-Comp Proceedings
ISSN 1759-3433
ISSN 1759-3433
CCP: 99
PROCEEDINGS OF THE ELEVENTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
PROCEEDINGS OF THE ELEVENTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY
Edited by: B.H.V. Topping
Paper 142
Analysis of Stress Concentrations in Adhesively-Bonded Assemblies subject to Thermo-Mechanical Loads: Application to the Characterisation of the Adhesive Behaviour
J.Y. Cognard1, C. Badulescu1, N. Carrère1, R. Créac'hcadec1 and P. Védrine2
1Laboratoire Brestois de Mécanique et des Systèmes, ENSTA Bretagne/Université de Brest/ENIB/UEB, France
2CEA Saclay, DSM/Irfu/SACM, Gif sur Yvette, France
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