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Civil-Comp Proceedings
ISSN 1759-3433
CCP: 52
Edited by: B.H.V. Topping
Paper VI.5

Multi-Physics Modelling for Interconnection Technology

C. Bailey, D. Wheeler and M. Cross

Department of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom

Full Bibliographic Reference for this paper
C. Bailey, D. Wheeler, M. Cross, "Multi-Physics Modelling for Interconnection Technology", in B.H.V. Topping, (Editor), "Advances in Computational Mechanics with High Performance Computing", Civil-Comp Press, Edinburgh, UK, pp 135-139, 1998. doi:10.4203/ccp.52.6.5
The connection of microprocessor chips to printed circuit boards (PCB's) is achieved using solder materials, which bond the leads of the chip to the board. In the reflow process a board assembly passes through a reflow furnace where the solder (initially in the form of solder paste) melts, reflows, then solidifies, and finally deforms between the chip and board. A number of defects may occur during this process such as cracking of the joint, chip or board. These defects are a serious concern to industry, especially with trends towards increasing component miniaturisation and smaller pitch sizes. Modelling each chip on a board in detail will require huge mesh sizes. Also, the amount of physics governing this process will require predicting a number of dependent variables, such as temperature and stress. and how they change over time. Parallel computing opens up the possibility of undertaking such large simulations. This paper presents a multi-physics modelling approach to predicting solder joint shape, solidification, and deformation (stress) during this manufacturing process. The future use of a parallel version of a multi-physics code will also be discussed.

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