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Civil-Comp Proceedings
ISSN 1759-3433
CCP: 24
Edited by: B.H.V. Topping and M. Papadrakakis
Paper VII.10

Vibration of Bonded Plates

C.C. Lin, R.C. Chu and T.C. Ko

College of Science, National Chung-Hsing University, Taichung, Taiwan

Full Bibliographic Reference for this paper
C.C. Lin, R.C. Chu, T.C. Ko, "Vibration of Bonded Plates", in B.H.V. Topping, M. Papadrakakis, (Editors), "Advances in Non-Linear Finite Element Methods", Civil-Comp Press, Edinburgh, UK, pp 263-272, 1994. doi:10.4203/ccp.24.7.10
An isoparametric adhesive interface element is used in the vibration analysis of adhesively bonded structures. The model assumes that transverse shear and peel stresses prevail in the adhesive layer. The analyses articulate separate responses of the upper and lower adherends and the adhesive. The natural frequencies of bonded laminated plates are found to agree well with the existing results for plates having a similar geometries. The present element, together with the 8-node isoparametric plate element based on a first order shear deformation theory used to model the upper and lower adherends, is found to be effective in solving free vibration problems of adhesively bonded laminated plates.

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